Please download the CFP flyer here 
(will be available soon).
Topics of Interest include but are not limited to:
| Advanced Chip Design and System Integration | IC Manufacturing, Emerging Devices, and Reliability |
| ·AI-Driven Chip Architecture and Hardware Acceleration ·High-Performance and Low-Power Processor Design ·System-on-Chip (SoC), Network-on-Chip (NoC), and Multi-Chip Modules ·3D-IC and Chiplet-Based Heterogeneous Integration ·Memory-Centric, Near-Memory, and In-Memory Computing ·Approximate, Stochastic, and Brain-Inspired Computing ·Reconfigurable Computing (FPGA, CPLD, and Coarse-Grained Reconfigurable Arrays) ·Domain-Specific Architectures (Automotive, Edge AI, IoT, etc.) ·Automated Design Methodology and EDA Toolchain Innovations ·Design-Technology Co-Optimization (DTCO) ·Analog, Mixed-Signal, and RF IC Design ·Radiation-Hardened and High-Temperature Chip Design for Extreme Environments |
·Advanced CMOS and Beyond-CMOS Device Technologies ·FinFET, GAA-FET, and Nanosheet/Nanowire Transistors ·Wide-Bandgap Semiconductor Materials and Devices (SiC, GaN, Diamond, etc.) ·Emerging Memory Technologies (RRAM, MRAM, PCM, FeRAM, etc.) ·Semiconductor Manufacturing Processes and Process Optimization ·Yield Enhancement, Defect-Tolerant Design, and Failure Analysis ·Chip Reliability, Aging Mechanisms, and Thermal Management ·Advanced Packaging Technologies (2.5D/3D, Fan-Out Wafer-Level, Si Photonics) ·Design for Testability (DFT), Built-In Self-Test (BIST), and ATE ·EDA for Manufacturability, Variability, and Reliability ·Hardware Security, Anti-Counterfeit, and Physical Unclonable Functions (PUF) ·Advanced Metrology, Inspection, and In-Situ Process Monitoring |