Welcome to the 2027 International Conference on Advanced Chip Design and Integrated Circuit Technology (ACDICT 2027)! We are delighted to have you join us from July 23–25, 2027.

As the semiconductor industry enters a new era of heterogeneous integration and AI-driven design, advanced chip architectures and integrated circuit technologies are redefining the limits of computing, connectivity, and energy efficiency. ACDICT 2027 brings together leading researchers, engineers, and industry professionals from around the globe to explore cutting-edge advancements in chip design methodologies, emerging semiconductor devices, manufacturing technologies, and system-level integration.

We warmly invite you to join us in China this July for this exciting event, and look forward to your contributions and inspiring discussions.

Topics of Interest include but are not limited to:

Advanced Chip Design and System Integration
·AI-Driven Chip Architecture and Hardware Acceleration ·High-Performance and Low-Power Processor Design ·System-on-Chip (SoC), Network-on-Chip (NoC), and Multi-Chip Modules ·3D-IC and Chiplet-Based Heterogeneous Integration ·Memory-Centric, Near-Memory, and In-Memory Computing ·Approximate, Stochastic, and Brain-Inspired Computing ·Reconfigurable Computing (FPGA, CPLD, and Coarse-Grained Reconfigurable Arrays) ·Domain-Specific Architectures (Automotive, Edge AI, IoT, etc.) ·Automated Design Methodology and EDA Toolchain Innovations ·Design-Technology Co-Optimization (DTCO) ·Analog, Mixed-Signal, and RF IC Design ·Radiation-Hardened and High-Temperature Chip Design for Extreme Environments
IC Manufacturing, Emerging Devices, and Reliability
·Advanced CMOS and Beyond-CMOS Device Technologies ·FinFET, GAA-FET, and Nanosheet/Nanowire Transistors ·Wide-Bandgap Semiconductor Materials and Devices (SiC, GaN, Diamond, etc.) ·Emerging Memory Technologies (RRAM, MRAM, PCM, FeRAM, etc.) ·Semiconductor Manufacturing Processes and Process Optimization ·Yield Enhancement, Defect-Tolerant Design, and Failure Analysis ·Chip Reliability, Aging Mechanisms, and Thermal Management ·Advanced Packaging Technologies (2.5D/3D, Fan-Out Wafer-Level, Si Photonics) ·Design for Testability (DFT), Built-In Self-Test (BIST), and ATE ·EDA for Manufacturability, Variability, and Reliability ·Hardware Security, Anti-Counterfeit, and Physical Unclonable Functions (PUF) ·Advanced Metrology, Inspection, and In-Situ Process Monitoring

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